As the need to dissipate heat from microelectronics packaging increases, the role of thermal interface material becomes crucial to the overall performance of the package and the selection of a heat sink. Gould Fasteners carries a selection of heat sinks from various manufacturers to suit every application.
848-130AB Series Heat Sinks
from: Wakefield Engineering
Wakefield Engineering's 848-130AB Series Heat Sinks provide maximum thermal performance within industry standard ATX/NLX chassis design parameters for Intel Corporation Pentium® II microprocessors. This heat sink is designed for use in the latest generation of desktop, deskside, and server systems which utilize Intel's new Pentium® II family of microprocessors. Standard clips easily and securely attach the heat sink to the Pentium® II SEC Slot 1 Cartridge. The optional pre-applied DeltaLink V "phase change" thermal interface material minimizes temperature drop without the mess of thermal compounds.
Heat Sinks can be supplied by Gould Fasteners from these manufacturers: